Email Us
Innovative Design & Manufacturing of High Density  Fiber Optic Solutions.
Products

AOC & DAC


T&S Active Optical Cables (AOC) deliver high-performance optical interconnects with data rates from 10Gbps to 800Gbps, supporting Ethernet, Fibre Channel, InfiniBand, PCIe, and more. Backed by experienced in-house R&D and manufacturing teams and world-class production capabilities, T&S offers a broad portfolio of standard and customized AOC solutions with excellent compatibility and diverse form factors. As one of the world’s largest fiber optic connector manufacturers, T&S provides unique strengths in optical design, quality control, and cost efficiency. Widely deployed in data centers, telecom, HPC, and storage systems, our AOCs enable fast delivery, flexible customization, and close customer collaboration. Whether for industry-standard or application-specific designs, T&S helps customers achieve leading-edge interconnect performance for next-generation connectivity.


T&S passive copper Direct Attach Cable (DAC) assemblies offer a high-speed, cost-effective solution for short-reach data center applications. Designed for power-efficient performance, our DACs support high port density and bandwidth while reducing overall system power consumption. T&S ensures consistent quality through strict manufacturing and testing processes, delivering reliable signal integrity and durable performance. Ideal for top-of-rack and in-rack connections, our passive copper cables provide a simple, low-latency alternative to optical transceivers for short-distance interconnects.

Clear
118 Results
56G QSFP+ Direct Attach Cable, Passive, Twinax Copper
56G QSFP+ Direct Attach Cable, Passive, Twinax Copper

40GBASE-CR4/10GBASE-CR  |  ≤0.1W  |  26/30AWG  |  47mm/35mm

40G QSFP+ to SFP+ Direct Attach Cable, Passive
40G QSFP+ to SFP+ Direct Attach Cable, Passive

40GBASE-CR4 TO 1x10GBASE-CR  |  ≤0.1W  |  26/30AWG  |  47mm/35mm

Need Help? Contact Our Product Experts or Sales Team Today!
  I agree with T&S’ Privacy Policy and Terms of Use
Latest News & Blog
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
Feb 12, 2026
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
T&S returned to the Asia Photonics Expo (APE 2026), held February 4–6 at the Sands Expo and Convention Centre in Singapore, marking the company’s second appearance at the event. During the show,...
DSP VS LPO
Nov 13, 2025
DSP VS LPO
1. Introduction: The “Power Bottleneck” in AI NetworksToday’s data center landscape is undergoing a profound transformation. The explosive growth of AI workloads, the rapid expansion of cloud-scale...
HCF VS MCF
Oct 31, 2025
HCF VS MCF
Is Hollow-Core or Multi-Core the Future of Fiber Technology? The question of whether Hollow-Core Fiber (HCF) or Multi-Core Fiber (MCF) will define the future of optical communication has become one of ...