T&S once again took center stage at the Optical Fiber Communication Conference and Exhibition (OFC) 2017, held at the Los Angeles Convention Center from March 21 to 23, 2017. Recognized as the world's largest global conference and exhibition for optical communications, OFC attracts industry giants and emerging innovators from across the globe.
T&S's ongoing participation in OFC underscores its dedication to advancing optical communication technologies. At the exhibition, T&S showcased its comprehensive portfolio of optical connectivity solutions, drawing significant interest from international buyers and industry professionals.
EN
jp 
fr 
es 
it 
ru 
pt 
ar 
el 
nl 
Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
