T&S made a strong presence at the 43rd European Conference on Optical Communication (ECOC), held from September 18 to 20, 2017, in Gothenburg, Sweden. As one of the premier events in the global optical communication industry, ECOC provides a platform for industry leaders, innovators, and suppliers to showcase their latest technologies.
During the exhibition, T&S highlighted its advanced optical connectivity solutions, attracting the attention of industry stakeholders and potential partners. By participating in ECOC 2017, T&S aimed to enhance its brand recognition, expand its market reach in Europe, and strengthen its network with industry leaders and clients.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
