T&S returned to the Asia Photonics Expo (APE 2026), held February 4–6 at the Sands Expo and Convention Centre in Singapore, marking the company’s second appearance at the event. During the show, the team engaged with customers and partners from across the global photonics industry.
At its booth, T&S highlighted a portfolio of solutions designed for high-density optical interconnect and co-packaged optics (CPO) architectures. Featured products included its full range of MT ferrules, MDC and MMC connectors, Fiber Optic Flex Circuit (FOFC), high-speed optical modules, the Ultra Series high-density enclosures (1U–4U), and multi-core fiber (MCF) fan-in/fan-out devices—targeted at data center and high-speed networking environments.
Throughout the exhibition, T&S held on-site meetings with international customers, strengthening existing relationships while exploring new opportunities for global cooperation.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")