T&S Shines at CIOE 2025, Showcasing New Trends in Optical Interconnects

At CIOE 2025, the T&S booth emerged as one of the most popular destinations in the Comprehensive Cabling Pavilion (Pavilion 9), drawing heavy foot traffic and lively engagement throughout the event. Both exhibitors and visitors praised T&S for its impressive product portfolio, cutting-edge technology, and dynamic on-site interactions, making it a focal point of attention at the show.

Comprehensive Product Portfolio on Full Display

T&S showcased a diversified range of innovative products, including fiber optic flex circuit (FOFC), multi-core polarization-maintaining(PM) patch cords, module patch cords, and AWG wafers/chips. The breadth and scale of exhibits reached an all-time high, attracting professionals from global data centers, telecommunications, and optoelectronics industries for in-depth discussions and collaboration opportunities.

FOFC Driving CPO Adoption

As Co-Packaged Optics (CPO) technology gains momentum, FOFC is emerging as a key solution for high-density fiber management in CPO applications. T&S introduced a more versatile product lineup this year, featuring the 4U Shuffle enclosure, 1U MTP-Port enclosure, Delay Line, Matched Line, and substrate-free version, underscoring the company’s innovation capabilities in high-density optical interconnect solutions.

Highlighting Fiber Array Units (FAUs)

Another highlight of the booth was the expanded range of module patch cord solutions, particularly the Fiber Array Unit (FAU). As a critical optical interface enabling high-density, low-loss connections between optical chips and fibers, FAUs are essential for scaling up CPO technology to next-generation data centers and high-performance computing (HPC) environments. T&S continues to strengthen its CPO product ecosystem, accelerating its presence in advanced optical interconnect markets worldwide.

Advancing Optical Chip Technologies

T&S also unveiled its latest breakthroughs in optical chip technologies, including self-developed 6-inch quartz-based AWG wafers and AWG Demux components, drawing interest from industry experts. Additionally, subsidiary TASLO showcased a full range of MT ferrules, MPO connector components, and AR/HR coating products, further enriching T&S’s presence across the optical interconnect value chain.

With an expanding product portfolio and continuous technological innovation, T&S is rapidly building a full-spectrum solution ecosystem—from optical chips and core components to fiber interconnects and high-density fiber management—helping drive the industry toward a future of higher performance and greater energy efficiency.