From March 5 to 7, 2019, T&S participated in the Optical Fiber Communication Conference and Exhibition (OFC) held at the San Diego Convention Center in the USA. T&S introduced three innovative fiber optic cabling solutions tailored for ultra-large and large data center cabling projects. The new products included a 1U 19" 144F high-density fiber optic enclosure with a guideway and transparent slim module cassettes, as well as the TS-FD1 and TS-FD2 series enclosures with 288F at 3U and 384F at 4U capacities. The product designs, featuring sleek silver front covers and premium guideway structures, attracted significant interest from professional buyers and industry experts. OFC is the world's largest conference and exhibition for optical communications, making it a vital platform for T&S to showcase its latest advancements.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
