T&S participated in the Optical Fiber Communication Conference and Exhibition (OFC) 2018, held in San Diego, USA, from March 11 to 15. As the premier global event for optical communications and networking professionals, OFC attracts the industry's leading players and showcases the latest advancements.
Continuing its tradition of excellence, T&S introduced several new high-density fiber optic cabling products, including its flagship 1U 19'' 144F fiber optic enclosure, as well as the TS-FD1 and TS-FD2 series with enhanced capacity and modular design. These products, aimed at ultra-large data center cabling projects, received significant attention from industry professionals, boosting T&S's reputation as a forward-thinking solutions provider.
EN
jp 
fr 
es 
it 
ru 
pt 
ar 
el 
nl 
Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
