T&S played a prominent role at the 19th China International Optoelectronic Exposition (CIOE) held in Shenzhen from September 6 to 9, 2017. As a key participant in the domestic optical communication sector, T&S leveraged the event to showcase its latest optical interconnection products.
Among the featured products were cable assemblies, ceramic ferrules, PLC splitters, silicon wafers, and the company's newly launched C-RAN solution. The exhibition attracted significant attention from domestic visitors and overseas clients alike, solidifying T&S's position as a leader in optical connectivity innovation. By exhibiting at CIOE, T&S not only demonstrated its technical capabilities but also reinforced its commitment to serving the evolving needs of the global optoelectronics industry.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
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