San Francisco, USA – April 1, 2025 (OFC 2025) – During OFC 2025, US Conec and T&S officially signed a global patent licensing agreement for the Miniature Duplex Connector (MDC). Under this agreement, T&S has been granted a non-exclusive license to manufacture and sell MDC high-density fiber optic connectors and adapters worldwide, utilizing 11 key US Conec patents.
Through this collaboration, T&S will commence large-scale production and distribution of MDC fiber optic cable assemblies and related products, providing essential components for 800G/1.6T Ethernet deployment while enabling high-reliability, high-density optical connectivity for co-packaged optics (CPO). Additionally, with supply support from US Conec, T&S will also manufacture and distribute Miniature Multi-fiber Connector (MMC) products, further strengthening its expertise and leadership in high-density optical interconnect solutions.
About T&S
T&S (SZSE: 300570) is a global leader in fiber optic cable assemblies and ferrules, dedicated to delivering high-performance optical interconnect solutions for the fiber optic industry. T&S’s product portfolio includes ceramic ferrules, MT ferrules, high-density fiber optic cable assemblies, as well as other passive optical components, active optical devices, and fiber optic sensing solutions. T&S products are widely used in telecommunications networks, data centers, computing infrastructure, industrial automation, rail transit, renewable energy, and aerospace applications. Headquartered in Shenzhen, China, T&S operates multiple manufacturing facilities worldwide, providing high-quality optical connectivity products and customized solutions to global customers. (www.china-tscom.com)
About US Conec
US Conec is a global leader in high-density optical interconnect technology, leveraging over 30 years of innovation and expertise in developing advanced optical connectivity solutions for data centers, enterprise networks, public infrastructure, industrial applications, and military systems. Headquartered in Hickory, North Carolina, USA, US Conec is backed by leading optical communication companies, including Corning, Fujikura, and NTT-AT. (www.usconec.com)
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
