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MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
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Links
T & s websitewww.china-tscom.comIndustry information platformhttp://www.iccsz.com/http://www.c-fol.net/http://opticalconnectionsnews.com/http://www.lightwaveonline.com/index.htmlhttps://www.lightr...
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Telcordia GR-326 Fiber Optic Connector Standard
Telcordia GR Standards are widely used in the global telecommunications industry due to their universality and practicality. There are specific categories designed for fiber optic connectors, such as ...
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Ceramic Ferrule Outer Diameter Inspection
This video presents our fully automatic outer diameter inspection equipment in action. Witness the high-speed, precise measurement process, enabling accurate, efficient quality control and ensuring consistent product standards in fiber optic component manufacturing.
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T&S Launches Sino-Japanese Joint Venture — TASLO
T&S Communications Co., Ltd., in collaboration with Japan's Logos and Shenzhen Tongshi Investment Co., Ltd., established a Sino-Japanese joint venture named TASLO. The joint venture was regist...
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Latest News & Blog
T&S Commemorates 18th Anniversary with Grand Celebration and Science Park Inauguration
Dec 12, 2018
T&S Commemorates 18th Anniversary with Grand Celebration and Science Park Inauguration
On December 12, 2018, T&S marked its 18th anniversary with a grand celebration and the official inauguration of the new T&S Science and Technology Park. The event took place at the Ramada Hote...
T&S Showcases Latest Innovations at the 44th ECOC Exhibition in Rome
Sep 29, 2018
T&S Showcases Latest Innovations at the 44th ECOC Exhibition in Rome
T&S proudly participated in the 44th European Conference on Optical Communication (ECOC) Exhibition, held in Rome, Italy. As Europe's largest exhibition in the optical communication technology...
T&S Highlights Cutting-Edge Solutions at the 20th CIOE in Shenzhen
Sep 10, 2018
T&S Highlights Cutting-Edge Solutions at the 20th CIOE in Shenzhen
T&S took part in the 20th China International Optoelectronic Exposition (CIOE), held in Shenzhen, China, from September 6 to 9, 2018. As one of the most prominent optoelectronic exhibitions global...