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MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
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Latest News & Blog
T&S Participates in SVIAZ 2019 in Moscow
Apr 25, 2019
T&S Participates in SVIAZ 2019 in Moscow
T&S took part in the SVIAZ 2019 exhibition held from April 23 to 26 in Moscow, Russia. Given the region's significant market potential, T&S has consistently participated in SVIAZ over the ...
T&S Unveils New High-Density Fiber Optic Solutions at OFC 2019
Mar 08, 2019
T&S Unveils New High-Density Fiber Optic Solutions at OFC 2019
From March 5 to 7, 2019, T&S participated in the Optical Fiber Communication Conference and Exhibition (OFC) held at the San Diego Convention Center in the USA. T&S introduced three innovative...
T&S Launches Sino-Japanese Joint Venture — TASLO
Feb 19, 2019
T&S Launches Sino-Japanese Joint Venture — TASLO
T&S Communications Co., Ltd., in collaboration with Japan's Logos and Shenzhen Tongshi Investment Co., Ltd., established a Sino-Japanese joint venture named TASLO. The joint venture was regist...