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US Conec and T&S Sign Global Patent Licensing Agreement for MDC
May 27, 2025
US Conec and T&S Sign Global Patent Licensing Agreement for MDC
San Francisco, USA – April 1, 2025 (OFC 2025) – During OFC 2025, US Conec and T&S officially signed a global patent licensing agreement for the Miniature Duplex Connector (MDC). Under this agree...
T&S Certified by US Conec for MMC Termination and Assembly
May 27, 2025
T&S Certified by US Conec for MMC Termination and Assembly
In October 2024, T&S Communications was officially certified by US Conec for its MMC connector and TMT ferrule termination and assembly capabilities, in full compliance with the stringent standard...
T&S Unveils Innovations in Ultra-High-Density Fiber Connectivity at APE 2025, Singapore
May 27, 2025
T&S Unveils Innovations in Ultra-High-Density Fiber Connectivity at APE 2025, Singapore
Singapore – February 26-28, 2025 – T&S Optical Technology made its debut at the Asia Photonics Expo (APE) 2025, presenting a suite of advanced optical connectivity solutions designed for next-ge...
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