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PLC Wafer
PLC Wafer

PLC Wafer

Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking, etching, etc. PLC splitter wafers can be designed for 1x2, 1x4, 1x8, 1x16, 1x32, 1x64 and 2xN. Splitter chips with high yield, quality and reliability, are made of PLC wafers through dicing and polishing.


Specifications of PLC Wafer

Optical Specifications
Wafer Specifications

Parameter

Class

Unit

1x2

1x4

1x8

1x16

1x32

1x64

Operating Wavelength

-

nm

1260-1650

Insertion Loss

P

dB

3.6

6.7

9.8

13.2

16.2

19.8

PDL

P

dB

0.15

0.15

0.2

0.25

0.25

0.3

Uniformity

P

dB

0.5

0.5

0.6

0.8

1.0

1.2

Return Loss

-

dB

-

≥55

Directivity

-

dB

-

≥55

Operating Temperature

-

-

-40~+85

Storage Temperature

-

-

-40~+85


Item No.

Description

Specification

1

Diameter

6inch(150±0.5mm)

2

Directional Flat

47.5mm

3

Flatness

<500μm

4

Material

Quartz


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