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PLC Wafer & Chip

PLC Wafer & Chip

As an experienced plc splitter factory, T&S offers PLC splitter wafers as well. Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking, etching, etc. PLC splitter wafers can be designed for 1x2, 1x4, 1x8, 1x16, 1x32, 1x64 and 2xN. Splitter chips with high yield, quality and reliability, are made of PLC wafers through dicing and polishing.


PLC Chip Features

  • Low PDL for PLC chip

  • Low IL for PLC chip 

  • T&S PLC chip has a wide operating wavelength: 1260-1650nm

  • Compact size

  • RoHS compliance



PLC Chip Applications

Among all PLC splitter manufacturers, T&S PLC chip can be applied in Optical communication networks, Telecom equipment, Three-Network-Integration systems, including Signal/power distribution, Fiber-To-The-Home (FTTH), Passive Optical Network (PON).

PLC Chip Specifications

Optical Specifications

Parameter

Class

Unit

1x2

1x4

1x8

1x16

1x32

1x64

Operating Wavelength

-

nm

1260 -1650

Insertion Loss

P

dB

3.6

6.7

9.8

13.2

16.2

19.8

PDL

P

dB

0.15

0.15

0.2

0.25

0.25

0.3

Uniformity

P

dB

0.5

0.5

0.6

0.8

1.0

1.2

Return Loss

-

dB

-

≥55

Directivity

-

dB

-

≥55

Operating Temperature

-

-

-40~+85

Storage Temperature

-

-

-40~+85


Core Components of PLC Chip


Core Components of PLC Splitter Chip


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