Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking, etching, etc. PLC splitter wafers can be designed for 1x2, 1x4, 1x8, 1x16, 1x32, 1x64 and 2xN. Splitter chips with high yield, quality and reliability, are made of PLC wafers through dicing and polishing.
Parameter | Class | Unit | 1x2 | 1x4 | 1x8 | 1x16 | 1x32 | 1x64 |
Operating Wavelength | - | nm | 1260-1650 | |||||
Insertion Loss | P | dB | 3.6 | 6.7 | 9.8 | 13.2 | 16.2 | 19.8 |
PDL | P | dB | 0.15 | 0.15 | 0.2 | 0.25 | 0.25 | 0.3 |
Uniformity | P | dB | 0.5 | 0.5 | 0.6 | 0.8 | 1.0 | 1.2 |
Return Loss | - | dB | - | ≥55 | ||||
Directivity | - | dB | - | ≥55 | ||||
Operating Temperature | - | ℃ | - | -40~+85 | ||||
Storage Temperature | - | ℃ | - | -40~+85 | ||||
Item No. | Description | Specification |
1 | Diameter | 6inch（150±0.5mm） |
2 | Directional Flat | 47.5mm |
3 | Flatness | ＜500μm |
4 | Material | Quartz |
T&S Exhibited at FIBERCONNECT 2017
15 Jun 2017
FIBERCONNECT this year was held in Orlando, Florida from June 12 to 14. T&S exhibited on the show for years in a row. T&S expanded cooperation with partners and increased T&S presence.
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