Name: PLC Wafer
Brand: T&S Communication Co, Ltd.

PLC Wafer

As an experienced plc splitter factory, T&S offers PLC splitter wafers as well. Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking, etching, etc. PLC splitter wafers can be designed for 1x2, 1x4, 1x8, 1x16, 1x32, 1x64 and 2xN. Splitter chips with high yield, quality and reliability, are made of PLC wafers through dicing and polishing.

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Specifications of PLC Wafer

Optical Specifications

Wafer Specifications

Parameter	Class	Unit	1x2	1x4	1x8	1x16	1x32	1x64
Operating Wavelength	-	nm	1260-1650
Insertion Loss	P	dB	3.6	6.7	9.8	13.2	16.2	19.8
PDL	P	dB	0.15	0.15	0.2	0.25	0.25	0.3
Uniformity	P	dB	0.5	0.5	0.6	0.8	1.0	1.2
Return Loss	-	dB	-	≥55
Directivity	-	dB	-	≥55
Operating Temperature	-	℃	-	-40~+85
Storage Temperature	-	℃	-	-40~+85

Item No.	Description	Specification
1	Diameter	6inch（150±0.5mm）
2	Directional Flat	47.5mm
3	Flatness	＜500μm
4	Material	Quartz