Based on Planar Lightwave Circuit technologies, PLC splitter wafers are produced on the quartz substrate through a series of processes including CVD deposition, photo-masking, etching, etc. PLC splitter wafers can be designed for 1x2, 1x4, 1x8, 1x16, 1x32, 1x64 and 2xN. Splitter chips with high yield, quality and reliability, are made of PLC wafers through dicing and polishing.
Parameter | Class | Unit | 1x2 | 1x4 | 1x8 | 1x16 | 1x32 | 1x64 |
Operating Wavelength | - | nm | 1260-1650 | |||||
Insertion Loss | P | dB | 3.6 | 6.7 | 9.8 | 13.2 | 16.2 | 19.8 |
PDL | P | dB | 0.15 | 0.15 | 0.2 | 0.25 | 0.25 | 0.3 |
Uniformity | P | dB | 0.5 | 0.5 | 0.6 | 0.8 | 1.0 | 1.2 |
Return Loss | - | dB | - | ≥55 | ||||
Directivity | - | dB | - | ≥55 | ||||
Operating Temperature | - | ℃ | - | -40~+85 | ||||
Storage Temperature | - | ℃ | - | -40~+85 | ||||
Item No. | Description | Specification |
1 | Diameter | 6inch（150±0.5mm） |
2 | Directional Flat | 47.5mm |
3 | Flatness | ＜500μm |
4 | Material | Quartz |
T&S Acquired Auspchip Technologies Co., Ltd.
25 Aug 2017
T&S acquired 100% equity of AuspChip Technologies Co., Ltd. previously owned by Shenzhen Anpeng on August 7.ACT, one of T&S suppliers, has been concentrated on developing.
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