T&S took part in the 20th China International Optoelectronic Exposition (CIOE), held in Shenzhen, China, from September 6 to 9, 2018. As one of the most prominent optoelectronic exhibitions globally, CIOE drew industry leaders, innovators, and buyers from across the world.
At its exhibition booth, T&S displayed its comprehensive range of optical communication products, including cable assemblies, ceramic ferrules, PLC splitters, silicon wafers, and its newly launched C-RAN solution. The showcase attracted strong interest from both domestic and international visitors, reinforcing T&S's position as a trusted provider of advanced optical connectivity solutions.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
