From September 6 to 9, 2016, T&S Communications Co., Ltd. participated in the 18th China International Optoelectronics Expo (CIOE) at the Shenzhen Convention & Exhibition Center. This premier event attracted over 3,200 leading companies from the optoelectronics industry.
At the expo, T&S showcased a diverse array of products, including ceramic ferrules, optical assemblies, PLC splitters, Wavelength Division Multiplexers (WDMs), couplers, and Fiber Bragg Gratings (FBGs). The event provided an excellent platform for T&S to strengthen relationships within the industry, increase brand awareness, and engage in knowledge exchange with competitors. Leveraging the insights gained, T&S is dedicated to continuous improvement and innovation to drive future development.
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Fiber Optic Flex Circuit (FOFC)
Advanced Simulation & Optimization, High Positioning Accuracy, Flexible Customization, Rigorous Reliability Testing
MDC Solution
US Conec's MDC connector is a Very Small Form Factor (VSFF) duplex optical connector, expertly designed for terminating single-mode and multimode fiber cables with diameters up to 2.0mm.
MMC Solution
US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
_and_High-Reflection_(HR)_Optical_Coatings.webp "Anti-Reflection (AR) and High-Reflection (HR) Optical Coatings")
