Email Us
2
1

Fiber Bragg Grating (FBG) Patch Strain Sensor, S04

Identifier: 160019

Stain Coefficient~1.2pm/με  |  ±2500με  |  -40℃~+80℃  |  Strain Error<1%

Features

  • Immune to electromagnetic interference

  • Compact size and lightweight design

  • Long operational lifespan

  • Easy to install

+ View More

Product Description of Fiber Bragg Grating (FBG) Patch Strain Sensor, S04

Utilizing Fiber Bragg Grating (FBG) measurement technology combined with T&S's patented sensor packaging technology, the FBG patch strain sensor enables precise micro-strain measurements without the need for calibration.

Specifications

Performance ParametersUnitSpecification
Strain Coefficientpm/με~1.2
Strain Error%<1
Operating Temperature°C-120
Strain Rangeμε-5000
Gauge Lengthmm22±1



Mechanical ParametersUnitSpecification
Dimensionsmm34.5×8×0.8
Weightg~2
Material-Stainless steel
Installation-Spot welding or adhesive bonding
Fiber Type-SMF-28e
Protective Sleeve Type-Φ0.9mm tubing
Pigtail Lengthm2 on each side



Optical ParametersUnitSpecification
Center Wavelengthnm1525 ~ 1565
Reflectivity%>75
Half-Power Bandwidthnm<0.3
Side Mode Suppression Ratio (SMSR)dB>15
Connector-FC/APC



Need Help? Contact Our Product Experts or Sales Team Today!
  I agree with T&S’ Privacy Policy and Terms of Use
Recently Viewed
Get in Touch
Please be as detailed as possible have to help us understand your enquiry and help us find the right person to handle your request.
Factory Tour
Click to have a 720 degree factory tour of T&S factories.
Make an Appointment
Make an appointment for an on-site factory tour or an online consultation with our product experts.
Not exactly what you're looking for? Try our customized service!
T&S Communications Co., Ltd.
Latest News & Blog
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
Feb 12, 2026
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
T&S returned to the Asia Photonics Expo (APE 2026), held February 4–6 at the Sands Expo and Convention Centre in Singapore, marking the company’s second appearance at the event. During the show,...
DSP VS LPO
Nov 13, 2025
DSP VS LPO
1. Introduction: The “Power Bottleneck” in AI NetworksToday’s data center landscape is undergoing a profound transformation. The explosive growth of AI workloads, the rapid expansion of cloud-scale...
HCF VS MCF
Oct 31, 2025
HCF VS MCF
Is Hollow-Core or Multi-Core the Future of Fiber Technology? The question of whether Hollow-Core Fiber (HCF) or Multi-Core Fiber (MCF) will define the future of optical communication has become one of ...