Email Us

CS/PC-LC/PC DuplexLC UnibootA-B OM4 MultimodeOFNP 2.0mmAqua Tight Buffered Patchcord

Identifier: 485017

10/25G/40G/100G Networks  |  VSFF Connector  |  ≤0.3dB IL

Features

  • High precision connector

  • UPC APC end face polish

  • Customized length available

  • 100% factory terminated and tested

  • ROHS Compliant

+ View More

Product Description of CS/PC-LC/PC DuplexLC UnibootA-B OM4 MultimodeOFNP 2.0mmAqua Tight Buffered Patchcord

Fiber patch cords provide interconnect and cross-connect of applications over installations in entrance facilities, telecommunications rooms, data centers, and at the desk. Duplex patch cords are typically used in patch panels and distribution boxes to connect the elements of optical networks. We can offer you SM (OS2) and MM (OM1, OM2, OM3, OM4, OM5) patch cords as well as bend insensitive single mode patch cords with fiber G657.A. Patch cords can be terminated with all standard connectors.

Specifications

Connector ACS/PCConnector BLC/PC
Fiber ModeMulti-modeWavelength850nm
Fiber TypeOM4Cable JacketPVC (OFNP)
Fiber Count2FCable StructureTight Buffered
PolarityA-BInsertion Loss≤0.3dB
Cable OD2.0mmAttenuation@1550nm1.0dB/km
Attenuation@1310nm3.0dB/kmOperating Temperature-10℃ ~ +60℃
Storage Temperature-40℃ ~ + 75℃Cable Tensile Strength(Long/Short)90N/150N
Installation Tensile Strength150NConnctor Durability≥500 times


Compliance

IEC 61754 Series/ IEC 61755 Endface Geometry/ IEC-61300-3-35

Need Help? Contact Our Product Experts or Sales Team Today!
  I agree with T&S’ Privacy Policy and Terms of Use
Recently Viewed
Get in Touch
Please be as detailed as possible have to help us understand your enquiry and help us find the right person to handle your request.
Factory Tour
Click to have a 720 degree factory tour of T&S factories.
Make an Appointment
Make an appointment for an on-site factory tour or an online consultation with our product experts.
Not exactly what you're looking for? Try our customized service!
T&S Communications Co., Ltd.
Latest News & Blog
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
Feb 12, 2026
T&S Showcases High-Density Optical Interconnect Portfolio at APE 2026
T&S returned to the Asia Photonics Expo (APE 2026), held February 4–6 at the Sands Expo and Convention Centre in Singapore, marking the company’s second appearance at the event. During the show,...
DSP VS LPO
Nov 13, 2025
DSP VS LPO
1. Introduction: The “Power Bottleneck” in AI NetworksToday’s data center landscape is undergoing a profound transformation. The explosive growth of AI workloads, the rapid expansion of cloud-scale...
HCF VS MCF
Oct 31, 2025
HCF VS MCF
Is Hollow-Core or Multi-Core the Future of Fiber Technology? The question of whether Hollow-Core Fiber (HCF) or Multi-Core Fiber (MCF) will define the future of optical communication has become one of ...