US Conec's Very Small Form Factor (VSFF) multi-fiber optical connector that redefines high-density connectivity with its cutting-edge TMT ferrule technology and intuitive Direct-Conec™ push-pull boot design.
3x cabling port density over the MPO format
DirectConec™ push-pull boot for effortless connector insertion and extraction
Utilizes proven MT or MT-16mechanical and fiber alignment structures
Compatible with standard 250 micron OD and pitch optical fibers
TMT Elite™ low-loss, IEC Grade B insertion loss performance
(0.25 dB 97% random intermate)
APC for both SM and MM applications
Available in 1x12, 1x16 and 2x12 variants
Tested to Telcordia GR-1435
Cables up to 2.5 mm OD
Standard cabling industry infrastructure support including
One-Click™ cleaners, polishers, interferometers, and optical testing equipment
Co-packaged optics and on-board connectivity
High bandwidth transceivers
Maximum density, low-loss, pre-terminated cabling infrastructure
The compact footprint of the MMC Jr. connector ensures a secure and reliable connection while conserving valu-able space in space-constrained environments. It is optimized for use in fiber optic transceivers, on-board optics, module cassettes, and data center interconnect applications.
MMC adapters are available in multiple port configurations, including versions that support direct mating be-tween MMC and MMC Jr.connectors. The 2-port adapter fits standard MPO cutouts, enabling a straightforward upgrade from MPO to MMC with double the port density. For higher-density applications, 4-port and 6-port op-tions are also available. Optional port covers are offered to block unused ports when needed.
T&S’s MMC cable terminations are fully certified by US Conec, ensuring high performance and reliability. With over 20 years of industry-recognized manufacturing expertise, T&S offers a comprehensive portfolio of MMC cable assemblies designed to meet evolving market demands. Leveraging our unparalleled processing know-how and flexible production capacity, we support extensive customization, enabling tailored solutions for diverse application scenarios. Guided by customer needs, T&S delivers precision, scalability, and fast turnaround to empower next-generation high-density optical interconnect deployments.
Modern hyperscale data centers demand ultra-high-speed parallel optical connections, but traditional spine-leaf architectures create cabling complexity—each leaf switch must connect to every spine switch, leading to tangled fiber bundles and inefficient layouts. T&S’s 4U Shuffle Enclosure with FOFC (Fiber Optic Flex Circuit) Technology overcomes this challenge in a revolutionary way: